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Wholesale Thermally Conductive Gel For Heat Sink Any Heat Generating Semiconductor

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Dongguan Ziitek Electronical Material and Technology Ltd.

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Wholesale Thermally Conductive Gel For Heat Sink Any Heat Generating Semiconductor

Name: Wholesale Thermally Conductive Gel For Heat Sink Any Heat Generating Semiconductor
Brand: Ziitek
Price: 0.1 USD

Wholesale Wholesale Thermally Conductive Gel For Heat Sink Any Heat Generating Semiconductor from china suppliers

Brand Name : Ziitek

Model Number : TIF030AB-05S Thermally Conductive Gel

Certification : UL

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

Name : Wholesale Thermally Conductive Gel For Heat sink any Heat Generating Semiconductor

Thermal Conductivity : 3.0W/mk

Hardness : 65 Shore 00

Color A/B : White / blue

Flame Rating : 94V0

Keyword : Thermally Conductive Gel

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Wholesale Thermally Conductive Gel For Heat sink any Heat Generating Semiconductor

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Ziitek TIF030AB-05S is a highly thermal conductive, liquid gap filling material. It is provide with two-component and different temperature curing system. The product was supplied as highly thermal conductive, soft and elastomer for coupling on electrical devices modul. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components. It is liquid approach offer variety of thickness, replacing individual die-cut and specific pad thickness. Different from grease, the cured product is dry and can be touch. It can intented for use in thermal applications.

< Good thermal conductive: 3.0W/mK

< UL recognized
< Naturally tacky needing no further adhesive coating
< Two-part formulation for easy storage
< High durability
< Optimized shear thinning characteristics for ease of dispensing

Applications

< Notebook
< Set top boxes
< Monitoring the Power Box
< High speed mass storage drives
< Heat sink any heat generating semiconductor

Typical Properties of TIF030AB-05S Series
Uncured Material Properties
Property	Numerical	Test Method
Color/Part A	White	Visual
Color/Part B	Blue	Visual
Part A Viscosity (mPa.s)	900,000 cps	GB/T 10247
Part B Viscosity (mPa.s)	1,500,000 cps	GB/T 10247
Flow Rate (g/min)	25	Ziitek Test Method
Density	3.1g/cc	ASTM D297
Bond Line thickness (mm)	0.2	Ziitek Test Method
Thermal resistance @10psi(℃•in²/W)	0.75	ASTM D5470
Thermal resistance @50psi(℃•in²/W)	0.45	ASTM D5470
Mix Ratio	0.042361111	******
Shelf Life	12 months	******
Cure Schedule
Pot Life @25℃	30min	Ziitek Test Method
Cure @25℃	16hrs	Ziitek Test Method
Cure @70℃	30min	Ziitek Test Method
Cure Material Properties
Color	Blue	Visual
Hardness	65 shore00	ASTM D2240
Continuous Use Temp	-45~200℃	Ziitek Test Method
Break Voltage	≥5500	ASTM D149
Flame Rating	94V0	UL E331100
Thermal Conductivity	3.0W/Mk	ASTM D5470

Product packing details:

50cc/pc, 48pcs/box; 400cc/pc, 9pcs/box
We offer the custom packaged in Syringes for automated despensing applications. Please contact us for confirming.

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Product Tags:

Heat Generating Semiconductor Thermally Conductive Putty

Heat sink Thermally Conductive Putty

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